CrushSCI.com
135.5平均天数
97.5中位天数
15最短天数
257最长天数
172025发文量

Paper Review Records

全部论文审稿周期

12 篇有效样本 · 按发表日期由新到旧排列
审稿天数=录用日期-收稿日期;保留 PDF/DOI/网页源链接

75 天

Characterization of a non-invasive dielectrophoresis ratchet microelectrode for electric-field-assisted HEK cell alignment and accumulation within defined gaps: in vitro study

作者
Revathy Deivasigamani; Abhay Kumar Mondal; Atiqah Salleh; Amin Kayani; Farhad Larki; Mohd Fauzi Mh Busra; Mohd Ambri Mohamed; Muhamad Ramdzan Buyong展开收起
作者单位
1. Universiti Kebangsaan Malaysia Institute of Microengineering and Nanoelectronic (IMEN), , Bangi,; 2. Fakulti Perubatan, Universiti Kebangsaan Malaysia Centre for Tissue Engineering and Regenerative Medicine, , Kuala Lumpur,; 3. RMIT University Functional Materials and Microsystems Research Group, , Melbourne,; 4. Universiti Kebangsaan Malaysia Institute of Microengineering and Nanoelectronic (IMEN), , Bangi, , and Laye Rooyan Part, Isfahan Science and Technology Town (ISTT), Isfahan, Iran展开收起
PDF源文件 DOI 网页
153 天

A fast-read, high-stability 12T hybrid TFET-FinFET SRAM cell with reduced control overhead and enhanced layout efficiency

作者
S. Arman Sabaghpour; Behzad Ebrahimi; Pooya Torkzadeh展开收起
作者单位
1. Islamic Azad University Department of Electrical and Computer Engineering, SR.C., , Tehran,展开收起
PDF源文件 DOI 网页
15 天

Strain-engineered ZnO/PVDF nanocomposite piezoelectric films for high-performance self-powered flexible wearable pressure sensors

作者
Rathna R展开收起
作者单位
1. R.M.K. Engineering College Department of ECE (ACT), , Chennai,展开收起
PDF源文件 DOI 网页
76 天

The science-governed interface: a critical review of advanced metallization, intelligent control and characterization strategies for wire bonding technology

作者
Muhammad Nubli Zulkifli展开收起
作者单位
1. Universiti Kuala Lumpur (UniKL) Electrical Engineering Section, British Malaysian Institute (BMI), , Gombak,展开收起
PDF源文件 DOI 网页
240 天

A 15 dBm CMOS Class-J power amplifier achieving 47% PAE and 20 dBm OIP3 for Bluetooth low energy application

作者
Rhusharhvin Dharsha Nath; Selvakumar Mariappan; Jagadheswaran Rajendran; Norhamizah Idros; Asrulnizam Abd Manaf; Narendra Kumar; Arokia Nathan; Binboga Siddik Yarman展开收起
作者单位
1. Universiti Sains Malaysia Collaborative Microelectronic Design Excellence Center, , Gelugor,; 2. University Malaya Department of Electrical Engineering, Faculty of Engineering, , Kuala Lumpur,; 3. Cambridge University Darwin College, , Cambridge,; 4. Istanbul University Department of Electrical and Electronics Engineering, , İstanbul,展开收起
PDF源文件 DOI 网页
257 天

Rectangular wire winding: homogenization and thermal analysis

作者
Ali Hashemi; Armin Hashemi展开收起
作者单位
1. Technical and Vocational University Department of Electrical Engineering, , Tehran, , and Department of Electrical Engineering, National University of Skills, Tehran, Iran; 2. Isfahan University of Technology Department of Mechanical Engineering, , Isfahan,展开收起
PDF源文件 DOI 网页

Expert Matching · Case Demo

把投稿要求,转成可验证的期刊方案

说清专业、时限和作者背景,CrushSCI 结合真实审稿样本,给出拟题方向、期刊初筛与周期判断。

我们会在半小时内回复。

CrushSCI 在线

客户询问

我是环境工程专业,需要一篇 SCI,希望 3 个月内见刊。没有基金,也没有大牛挂名,可以投哪些期刊?

CrushSCI回复

可以。先按 90 天时限做可行性筛选,同步查找无基金、无知名作者挂靠的典型论文案例,作为选刊依据。重点核对研究质量与期刊 scope。

拟题建议
《融合机器学习与生命周期评价的城市污水处理碳排放预测与优化》

样本口径2026 年最近 5 篇有效论文样本

平均审稿62 天

中位数65 天

Contact CrushSCI

联系 CrushSCI

留下手机号或微信号,我们将与你确认学术润色、结构优化或一对一辅导咨询需求。

我们会在半小时内回复。

当前选择:学术咨询服务

预留联系方式

也可以直接发送邮件至 [email protected]

手机号和微信号至少填写一项,仅用于本次咨询联系,不会公开。