Paper Review Records
All Paper Review Records
12 valid samples · Newest publication first
Review days = acceptance date − received date. PDF, DOI, and publisher-page sources are retained.
75
days
Characterization of a non-invasive dielectrophoresis ratchet microelectrode for electric-field-assisted HEK cell alignment and accumulation within defined gaps: in vitro study
Authors
Revathy Deivasigamani; Abhay Kumar Mondal; Atiqah Salleh; Amin Kayani; Farhad Larki; Mohd Fauzi Mh Busra; Mohd Ambri Mohamed; Muhamad Ramdzan BuyongShow moreShow less
Affiliations
1. Universiti Kebangsaan Malaysia Institute of Microengineering and Nanoelectronic (IMEN), , Bangi,; 2. Fakulti Perubatan, Universiti Kebangsaan Malaysia Centre for Tissue Engineering and Regenerative Medicine, , Kuala Lumpur,; 3. RMIT University Functional Materials and Microsystems Research Group, , Melbourne,; 4. Universiti Kebangsaan Malaysia Institute of Microengineering and Nanoelectronic (IMEN), , Bangi, , and Laye Rooyan Part, Isfahan Science and Technology Town (ISTT), Isfahan, IranShow moreShow less
153
days
A fast-read, high-stability 12T hybrid TFET-FinFET SRAM cell with reduced control overhead and enhanced layout efficiency
Authors
S. Arman Sabaghpour; Behzad Ebrahimi; Pooya TorkzadehShow moreShow less
Affiliations
1. Islamic Azad University Department of Electrical and Computer Engineering, SR.C., , Tehran,Show moreShow less
15
days
Strain-engineered ZnO/PVDF nanocomposite piezoelectric films for high-performance self-powered flexible wearable pressure sensors
Authors
Rathna RShow moreShow less
Affiliations
1. R.M.K. Engineering College Department of ECE (ACT), , Chennai,Show moreShow less
76
days
The science-governed interface: a critical review of advanced metallization, intelligent control and characterization strategies for wire bonding technology
Authors
Muhammad Nubli ZulkifliShow moreShow less
Affiliations
1. Universiti Kuala Lumpur (UniKL) Electrical Engineering Section, British Malaysian Institute (BMI), , Gombak,Show moreShow less
240
days
A 15 dBm CMOS Class-J power amplifier achieving 47% PAE and 20 dBm OIP3 for Bluetooth low energy application
Authors
Rhusharhvin Dharsha Nath; Selvakumar Mariappan; Jagadheswaran Rajendran; Norhamizah Idros; Asrulnizam Abd Manaf; Narendra Kumar; Arokia Nathan; Binboga Siddik YarmanShow moreShow less
Affiliations
1. Universiti Sains Malaysia Collaborative Microelectronic Design Excellence Center, , Gelugor,; 2. University Malaya Department of Electrical Engineering, Faculty of Engineering, , Kuala Lumpur,; 3. Cambridge University Darwin College, , Cambridge,; 4. Istanbul University Department of Electrical and Electronics Engineering, , İstanbul,Show moreShow less
257
days
Rectangular wire winding: homogenization and thermal analysis
Authors
Ali Hashemi; Armin HashemiShow moreShow less
Affiliations
1. Technical and Vocational University Department of Electrical Engineering, , Tehran, , and Department of Electrical Engineering, National University of Skills, Tehran, Iran; 2. Isfahan University of Technology Department of Mechanical Engineering, , Isfahan,Show moreShow less
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