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MICROELECTRONICS INTERNATIONAL 临时占位封面 Engineering
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Review Cycle Records

MICROELECTRONICS INTERNATIONAL

Emerald (MCB UP) SCIE Non-OA
2026 Emerging Zone 42025 CAS Zone 42025 JCR Q4
148.1Average days
125Median days
15Fastest days
257Longest days
172025 publications

Paper Review Records

All Paper Review Records

10 valid samples · Newest publication first
Review days = acceptance date − received date. PDF, DOI, and publisher-page sources are retained.

250 days

Design and finite element simulation of a novel bimorph cantilever-based piezoelectric micromachined ultrasonic transducer with enhanced acoustic performance

AuthorsYanyuan Ba; Yiming Li; Xuecong Hu; Zhenghu Zhang; Yijia Du

Affiliations1. Henan Normal University School of Electronic and Electrical Engineering, , Xinxiang,; 2. Hefei Pilotage Microsystem Integration Co., Ltd , Hefei,

Source PDF DOI Publisher page
234 days

Experimental study for dual-channel-MCM reliability with complex condition

AuthorsQian Lin; Xu-Qin Wang; Mei-Qian Wang; Hai-Feng Wu; Lin-Sheng Liu

Affiliations1. Guang’an Institute of Technology College of Electronics Information Engineer, , Guang’an, , and College of Intelligent Science and Engineering, Qinghai Minzu University, Xining, China; 2. Qinghai Minzu University College of Intelligent Science and Engineering, , Xining,; 3. Chengdu University of Technology College of Mechatronics Engineering, , Chengdu,

Source PDF DOI Publisher page
84 days

A 122 dB gain fully differential op-amp with a rail-to-rail output and novel offset compensation scheme

AuthorsAnupama A; Deepu Roy; Immanuel Raja; Padmakumar K

Affiliations1. Indian Institute of Space Science and Technology Department of Avionics, , Thiruvananthapuram,; 2. Vikram Sarabhai Space Centre , Thiruvananthapuram,

Source PDF DOI Publisher page
97 days

Reliability analysis of power converters in hybrid transformers considering the common fault conditions

AuthorsWeiming Chen; Yurun Lin; Zewen Li; Yuanliang Fan

Affiliations1. State Grid Fujian Electric Power Research Institute Enterprise Key Laboratory of Electric Distribution Technology for High Reliable Power Supply of Fujian Province, , Fuzhou,

Source PDF DOI Publisher page
75 days

Characterization of a non-invasive dielectrophoresis ratchet microelectrode for electric-field-assisted HEK cell alignment and accumulation within defined gaps: in vitro study

AuthorsRevathy Deivasigamani; Abhay Kumar Mondal; Atiqah Salleh; Amin Kayani; Farhad Larki; Mohd Fauzi Mh Busra; Mohd Ambri Mohamed; Muhamad Ramdzan Buyong

Affiliations1. Universiti Kebangsaan Malaysia Institute of Microengineering and Nanoelectronic (IMEN), , Bangi,; 2. Fakulti Perubatan, Universiti Kebangsaan Malaysia Centre for Tissue Engineering and Regenerative Medicine, , Kuala Lumpur,; 3. RMIT University Functional Materials and Microsystems Research Group, , Melbourne,; 4. Universiti Kebangsaan Malaysia Institute of Microengineering and Nanoelectronic (IMEN), , Bangi, , and Laye Rooyan Part, Isfahan Science and Technology Town (ISTT), Isfahan, Iran

Source PDF DOI Publisher page
153 days

A fast-read, high-stability 12T hybrid TFET-FinFET SRAM cell with reduced control overhead and enhanced layout efficiency

AuthorsS. Arman Sabaghpour; Behzad Ebrahimi; Pooya Torkzadeh

Affiliations1. Islamic Azad University Department of Electrical and Computer Engineering, SR.C., , Tehran,

Source PDF DOI Publisher page
15 days

Strain-engineered ZnO/PVDF nanocomposite piezoelectric films for high-performance self-powered flexible wearable pressure sensors

AuthorsRathna R

Affiliations1. R.M.K. Engineering College Department of ECE (ACT), , Chennai,

Source PDF DOI Publisher page
76 days

The science-governed interface: a critical review of advanced metallization, intelligent control and characterization strategies for wire bonding technology

AuthorsMuhammad Nubli Zulkifli

Affiliations1. Universiti Kuala Lumpur (UniKL) Electrical Engineering Section, British Malaysian Institute (BMI), , Gombak,

Source PDF DOI Publisher page
240 days

A 15 dBm CMOS Class-J power amplifier achieving 47% PAE and 20 dBm OIP3 for Bluetooth low energy application

AuthorsRhusharhvin Dharsha Nath; Selvakumar Mariappan; Jagadheswaran Rajendran; Norhamizah Idros; Asrulnizam Abd Manaf; Narendra Kumar; Arokia Nathan; Binboga Siddik Yarman

Affiliations1. Universiti Sains Malaysia Collaborative Microelectronic Design Excellence Center, , Gelugor,; 2. University Malaya Department of Electrical Engineering, Faculty of Engineering, , Kuala Lumpur,; 3. Cambridge University Darwin College, , Cambridge,; 4. Istanbul University Department of Electrical and Electronics Engineering, , İstanbul,

Source PDF DOI Publisher page
257 days

Rectangular wire winding: homogenization and thermal analysis

AuthorsAli Hashemi; Armin Hashemi

Affiliations1. Technical and Vocational University Department of Electrical Engineering, , Tehran, , and Department of Electrical Engineering, National University of Skills, Tehran, Iran; 2. Isfahan University of Technology Department of Mechanical Engineering, , Isfahan,

Source PDF DOI Publisher page

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Machine Learning and Life-Cycle Assessment for Predicting and Optimizing Carbon Emissions in Urban Wastewater Treatment

SampleLatest 5 valid paper samples from 2026

Average review96.4 days

Median77 days

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