Paper Review Records
All Paper Review Records
10 valid samples · Newest publication first
Review days = acceptance date − received date. PDF, DOI, and publisher-page sources are retained.
Design and finite element simulation of a novel bimorph cantilever-based piezoelectric micromachined ultrasonic transducer with enhanced acoustic performance
AuthorsYanyuan Ba; Yiming Li; Xuecong Hu; Zhenghu Zhang; Yijia Du
Affiliations1. Henan Normal University School of Electronic and Electrical Engineering, , Xinxiang,; 2. Hefei Pilotage Microsystem Integration Co., Ltd , Hefei,
Experimental study for dual-channel-MCM reliability with complex condition
AuthorsQian Lin; Xu-Qin Wang; Mei-Qian Wang; Hai-Feng Wu; Lin-Sheng Liu
Affiliations1. Guang’an Institute of Technology College of Electronics Information Engineer, , Guang’an, , and College of Intelligent Science and Engineering, Qinghai Minzu University, Xining, China; 2. Qinghai Minzu University College of Intelligent Science and Engineering, , Xining,; 3. Chengdu University of Technology College of Mechatronics Engineering, , Chengdu,
A 122 dB gain fully differential op-amp with a rail-to-rail output and novel offset compensation scheme
AuthorsAnupama A; Deepu Roy; Immanuel Raja; Padmakumar K
Affiliations1. Indian Institute of Space Science and Technology Department of Avionics, , Thiruvananthapuram,; 2. Vikram Sarabhai Space Centre , Thiruvananthapuram,
Reliability analysis of power converters in hybrid transformers considering the common fault conditions
AuthorsWeiming Chen; Yurun Lin; Zewen Li; Yuanliang Fan
Affiliations1. State Grid Fujian Electric Power Research Institute Enterprise Key Laboratory of Electric Distribution Technology for High Reliable Power Supply of Fujian Province, , Fuzhou,
Characterization of a non-invasive dielectrophoresis ratchet microelectrode for electric-field-assisted HEK cell alignment and accumulation within defined gaps: in vitro study
AuthorsRevathy Deivasigamani; Abhay Kumar Mondal; Atiqah Salleh; Amin Kayani; Farhad Larki; Mohd Fauzi Mh Busra; Mohd Ambri Mohamed; Muhamad Ramdzan Buyong
Affiliations1. Universiti Kebangsaan Malaysia Institute of Microengineering and Nanoelectronic (IMEN), , Bangi,; 2. Fakulti Perubatan, Universiti Kebangsaan Malaysia Centre for Tissue Engineering and Regenerative Medicine, , Kuala Lumpur,; 3. RMIT University Functional Materials and Microsystems Research Group, , Melbourne,; 4. Universiti Kebangsaan Malaysia Institute of Microengineering and Nanoelectronic (IMEN), , Bangi, , and Laye Rooyan Part, Isfahan Science and Technology Town (ISTT), Isfahan, Iran
A fast-read, high-stability 12T hybrid TFET-FinFET SRAM cell with reduced control overhead and enhanced layout efficiency
AuthorsS. Arman Sabaghpour; Behzad Ebrahimi; Pooya Torkzadeh
Affiliations1. Islamic Azad University Department of Electrical and Computer Engineering, SR.C., , Tehran,
Strain-engineered ZnO/PVDF nanocomposite piezoelectric films for high-performance self-powered flexible wearable pressure sensors
AuthorsRathna R
Affiliations1. R.M.K. Engineering College Department of ECE (ACT), , Chennai,
The science-governed interface: a critical review of advanced metallization, intelligent control and characterization strategies for wire bonding technology
AuthorsMuhammad Nubli Zulkifli
Affiliations1. Universiti Kuala Lumpur (UniKL) Electrical Engineering Section, British Malaysian Institute (BMI), , Gombak,
A 15 dBm CMOS Class-J power amplifier achieving 47% PAE and 20 dBm OIP3 for Bluetooth low energy application
AuthorsRhusharhvin Dharsha Nath; Selvakumar Mariappan; Jagadheswaran Rajendran; Norhamizah Idros; Asrulnizam Abd Manaf; Narendra Kumar; Arokia Nathan; Binboga Siddik Yarman
Affiliations1. Universiti Sains Malaysia Collaborative Microelectronic Design Excellence Center, , Gelugor,; 2. University Malaya Department of Electrical Engineering, Faculty of Engineering, , Kuala Lumpur,; 3. Cambridge University Darwin College, , Cambridge,; 4. Istanbul University Department of Electrical and Electronics Engineering, , İstanbul,
Rectangular wire winding: homogenization and thermal analysis
AuthorsAli Hashemi; Armin Hashemi
Affiliations1. Technical and Vocational University Department of Electrical Engineering, , Tehran, , and Department of Electrical Engineering, National University of Skills, Tehran, Iran; 2. Isfahan University of Technology Department of Mechanical Engineering, , Isfahan,
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