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MICROELECTRONICS INTERNATIONAL
数据更新 2026-07-16 · 完整周期 10 篇 · 日期来源可逐条复核
MICROELECTRONICS INTERNATIONAL已收录10篇完整论文周期样本，平均审稿148.1 天，中位审稿125 天。2025中科院4区，非OA，2025发文量17。页面含论文收到日期、录用日期、PDF、DOI和出版社网页溯源入口。
Latest Papers
最新发表论文审稿周期
审稿天数=录用日期-收到日期；保留 PDF/DOI/网页源链接
250
天
Design and finite element simulation of a novel bimorph cantilever-based piezoelectric micromachined ultrasonic transducer with enhanced acoustic performance
作者Yanyuan Ba; Yiming Li; Xuecong Hu; Zhenghu Zhang; Yijia Du
作者单位1. Henan Normal University School of Electronic and Electrical Engineering, , Xinxiang,; 2. Hefei Pilotage Microsystem Integration Co., Ltd , Hefei,
234
天
Experimental study for dual-channel-MCM reliability with complex condition
作者Qian Lin; Xu-Qin Wang; Mei-Qian Wang; Hai-Feng Wu; Lin-Sheng Liu
作者单位1. Guang’an Institute of Technology College of Electronics Information Engineer, , Guang’an, , and College of Intelligent Science and Engineering, Qinghai Minzu University, Xining, China; 2. Qinghai Minzu University College of Intelligent Science and Engineering, , Xining,; 3. Chengdu University of Technology College of Mechatronics Engineering, , Chengdu,
84
天
A 122 dB gain fully differential op-amp with a rail-to-rail output and novel offset compensation scheme
作者Anupama A; Deepu Roy; Immanuel Raja; Padmakumar K
作者单位1. Indian Institute of Space Science and Technology Department of Avionics, , Thiruvananthapuram,; 2. Vikram Sarabhai Space Centre , Thiruvananthapuram,
97
天
Reliability analysis of power converters in hybrid transformers considering the common fault conditions
作者Weiming Chen; Yurun Lin; Zewen Li; Yuanliang Fan
作者单位1. State Grid Fujian Electric Power Research Institute Enterprise Key Laboratory of Electric Distribution Technology for High Reliable Power Supply of Fujian Province, , Fuzhou,
75
天
Characterization of a non-invasive dielectrophoresis ratchet microelectrode for electric-field-assisted HEK cell alignment and accumulation within defined gaps: in vitro study
作者Revathy Deivasigamani; Abhay Kumar Mondal; Atiqah Salleh; Amin Kayani; Farhad Larki; Mohd Fauzi Mh Busra; Mohd Ambri Mohamed; Muhamad Ramdzan Buyong
作者单位1. Universiti Kebangsaan Malaysia Institute of Microengineering and Nanoelectronic (IMEN), , Bangi,; 2. Fakulti Perubatan, Universiti Kebangsaan Malaysia Centre for Tissue Engineering and Regenerative Medicine, , Kuala Lumpur,; 3. RMIT University Functional Materials and Microsystems Research Group, , Melbourne,; 4. Universiti Kebangsaan Malaysia Institute of Microengineering and Nanoelectronic (IMEN), , Bangi, , and Laye Rooyan Part, Isfahan Science and Technology Town (ISTT), Isfahan, Iran
153
天
15
天
76
天
The science-governed interface: a critical review of advanced metallization, intelligent control and characterization strategies for wire bonding technology
作者Muhammad Nubli Zulkifli
作者单位1. Universiti Kuala Lumpur (UniKL) Electrical Engineering Section, British Malaysian Institute (BMI), , Gombak,
240
天
A 15 dBm CMOS Class-J power amplifier achieving 47% PAE and 20 dBm OIP3 for Bluetooth low energy application
作者Rhusharhvin Dharsha Nath; Selvakumar Mariappan; Jagadheswaran Rajendran; Norhamizah Idros; Asrulnizam Abd Manaf; Narendra Kumar; Arokia Nathan; Binboga Siddik Yarman
作者单位1. Universiti Sains Malaysia Collaborative Microelectronic Design Excellence Center, , Gelugor,; 2. University Malaya Department of Electrical Engineering, Faculty of Engineering, , Kuala Lumpur,; 3. Cambridge University Darwin College, , Cambridge,; 4. Istanbul University Department of Electrical and Electronics Engineering, , İstanbul,
257
天
Rectangular wire winding: homogenization and thermal analysis
作者Ali Hashemi; Armin Hashemi
作者单位1. Technical and Vocational University Department of Electrical Engineering, , Tehran, , and Department of Electrical Engineering, National University of Skills, Tehran, Iran; 2. Isfahan University of Technology Department of Mechanical Engineering, , Isfahan,