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132.2Average days
111Median days
23Fastest days
302Longest days
3112025 publications

Paper Review Records

All Paper Review Records

23 valid samples · Newest publication first
Review days = acceptance date − received date. PDF, DOI, and publisher-page sources are retained.

96 days

Microbump reliability of silicon bridges for chiplets heterogeneous integration

Authors
John H. Lau; Ning Liu; Tzyy-Jang TsengShow moreShow less
Affiliations
Unimicron Technology Corporation, Taoyun, TaiwanShow moreShow less
Source PDF DOI Publisher page
116 days

Gate-metal-dependent transition of leakage mechanisms in AlGaN/GaN HEMTs under temperature-dependent conditions

Authors
Maria Glória Caño de Andrade; Josué Cândido; Eddy SimoenShow moreShow less
Affiliations
São Paulo State University (UNESP), Institute of Science and Technology, Av. 3 de Março, n. 511, 18087-180, Sorocaba, Brazil; Ghent University, Belgium; imec Kapeldreef 75, B-3001, Leuven, BelgiumShow moreShow less
Source PDF DOI Publisher page
223 days

Machine learning approach for accelerated reliability testing of integrated photonics

Authors
Lea Chaccour; Kristif Prifti; Ben Hasenson; Dzmitry Pustakhod; Sylwester LatkowskiShow moreShow less
Affiliations
Photonics Integration Technology Center (PITC), Eindhoven University of Technology (TU/e), De Groene Loper 19, Eindhoven, 5612 AP, The Netherlands; Photonic Integration Group, Eindhoven University of Technology (TU/e), De Groene Loper 19, Eindhoven, 5612 AP, The Netherlands; VTEC Lasers & Sensors, Torenallee 20, Eindhoven, 5617 BC, The NetherlandsShow moreShow less
Source PDF DOI Publisher page
62 days

Accelerated electro-thermo-mechanical co-simulation of power modules using reduced-order modeling and neural network-based field reconstruction

Authors
Célestin Ott; Gaëtan Perez; Pierre Perichon; Raphaël Morvillier; Romain GwozieckiShow moreShow less
Affiliations
Université Grenoble Alpes, CEA, Leti, F-38000 Grenoble, FranceShow moreShow less
Source PDF DOI Publisher page
60 days

Innovative FA hardware solution to enable system-level debug of 3D ICs

Authors
Lesly Endrinal; Jehan Saujauddin; YuanChung Ho; Dilbagh Singh; Sasi Sekaran Sundaresan; Vinod Kumar Kakumanu; Jessen Gonzalez; Willem D. van Driel; G.Q. ZhangShow moreShow less
Affiliations
Google LLC, 6420 Sequence Drive, San Diego, CA, 92126, United States of America; Google LLC, 2015 Stierlin Ct, Mountain View, CA, 94043, United States of America; Department of Microelectronics, Delft University of Technology, the NetherlandsShow moreShow less
Source PDF DOI Publisher page
181 days

Modeling moisture effects on Time-Dependent Dielectric Breakdown in galvanic isolators based on polymeric dielectrics

Authors
Jurij L. Mazzola; Gabriele L. Scarpiello; Matteo Greatti; Tarundeep Singh; Francesco Guzzi; Fabrizio Speroni; Marco Salina; Donata Asnaghi; Michele Lauria; Dario Paci; Vincenzo Marano; Alessandro S. Spinelli; Christian Monzio Compagnoni; Gerardo MalavenaShow moreShow less
Affiliations
Dipartimento di Elettronica, Informazione e Bioingegneria, via Golgi 42, 20133, Milano, Italy; STMicroelectronics, via Tolomeo 1, 20007, Cornaredo (MI), Italy; STMicroelectronics, via Camillo Olivetti 2, 20864, Agrate Brianza (MI), ItalyShow moreShow less
Source PDF DOI Publisher page

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Machine Learning and Life-Cycle Assessment for Predicting and Optimizing Carbon Emissions in Urban Wastewater Treatment

SampleLatest 5 valid paper samples from 2026

Average review62 days

Median65 days

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