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JOURNAL OF BUSINESS AND PSYCHOLOGY
数据更新 2026-07-16 · 完整周期 10 篇 · 日期来源可逐条复核
JOURNAL OF BUSINESS AND PSYCHOLOGY已收录10篇完整论文周期样本，平均审稿240.9 天，中位审稿248.5 天。2025中科院2区，非OA，2025发文量92。页面含论文收到日期、录用日期、PDF、DOI和出版社网页溯源入口。
Latest Papers
最新发表论文审稿周期
审稿天数=录用日期-收到日期；保留 PDF/DOI/网页源链接
196
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435
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Proactive Personality and Creativity: Autonomy and Information Processing as Substitutes in Trait Activation
作者Daan van Knippenberg; Saleem Mistry; Bradley L. Kirkman; Giles Hirst; Jia Li
作者单位1. Jones Graduate School of Business, Rice University, Houston, USA; 2. Lerner College of Business & Economics, University of Delaware, Newark, USA; 3. Poole College of Management, North Carolina State University, Raleigh, USA; 4. College of Business and Economics, Australian National University, Canberra, USA; 5. Faculty of Social Sciences, University of Copenhagen, Copenhagen, Denmark
301
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461
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168
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189
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Organizational Climate Shapes Employee Behavior Through Social Norms
作者Malte Roswag; Jan A. Häusser; Philipp Hubert; Sascha Etgen; Andreas Mojzisch
作者单位1. University of Hildesheim, Hildesheim, Germany; 2. Freie Universität Berlin, Berlin, Germany; 3. Justus-Liebig-University Giessen, Giessen, Germany
9
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Correction to: Unpacking the Patchwork of Fit: How Different Types of Person–Environment Fit Interact?
作者Yih‑Teen Lee; Tae‑Yeol Kim; Meng Chen; Diogo Zanata
作者单位1. IESE Business School, Barcelona, Spain; 2. Hope College, Holland, United States; 3. China Europe International Business School, Shanghai, China; 4. Sidewalk Entertainment, Shanghai, China; 5. ISE Business School, Sao Paulo, Brazil
308
天
The Double-Edged Sword of Digital Communication: A Social Network Analysis of Email’s Influence on Employee Performance and Well-Being
作者Natalia Bagnoli; Gabriele Boccoli; Elia Rigamonti; Luca Gastaldi; Andrea Fronzetti Colladon; Leonardo Di Perna; Matteo Matteucci; Mariano Corso
作者单位1. Department of Management, Economics and Industrial Engineering, Politecnico Di Milano, Milan, Italy; 2. Department of Civil, Computer Science and Aeronautical Technologies Engineering, Roma Tre University, Rome, Italy; 3. Department of Electronics, Information and Bioengineering, Politecnico Di Milano, Milan, Italy