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材料科学
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全部论文审稿周期
12 篇有效样本 · 按发表日期由新到旧排列
审稿天数=录用日期-收稿日期；保留 PDF/DOI/网页源链接
11
天
33
天
Comparative study of tensile creep behaviour of lead-free solder alloys and conventional Sn–Pb solder
作者DSouza, Rudolf; Mendonca, Sharun; Prabhu, Ravikantha; Bhat, Thirumaleshwara
作者单位1. Department of Mechanical Engineering, St Joseph Engineering College , Mangalore, India; 2. Department of Mechanical Engineering, BNM Institute of Technology , Bengaluru, India
33
天
Corrosion and hardness properties of SAC305/Cu solder joint by microwave hybrid heating
作者Naeem, Uzair; Guan Yi, Ow; Md Yusof, Enis Nadia; Salim, Mohd Azli; Makhkamov, Anvar; Alshoaibi, Adil; Wang, Dawei; Mohamad, Ahmad Azmin
作者单位1. Energy Materials Research Group (EMRG), School of Materials and Mineral Resources Engineering, Universiti Sains Malaysia , Nibong Tebal, Malaysia; 2. Chemical Sciences Programme, School of Distance Education, Universiti Sains Malaysia , Minden, Malaysia; 3. Fakulti Teknologi dan Kejuruteraan Mekanikal, Universiti Teknikal Malaysia Melaka , Durian Tunggal, Malaysia; 4. Department of Technological Machines and Equipment, Namangan State Technical University , Namangan, Uzbekistan; 5. Department of Physics, College of Science, King Faisal University , Hofuf, Saudi Arabia; 6. School of Instrumentation Science and Engineering, Harbin Institute of Technology , Harbin, China; 7. Energy Materials Research Group (EMRG), School of Materials and Mineral Resources Engineering, Universiti Sains Malaysia , Nibong Tebal, Malaysia , and Department of Chemical Engineering, Faculty of Engineering, Chulalongkorn University, Bangkok, Thailand
78
天
L-shaped epoxy reinforcement optimization for vibration reliability of microspring array pins in aerospace large-scale integrated circuits
作者Xiang, Yuyan; Jingming, Fei; Hongmei, Zhang; Qi, An
作者单位1. China Academy of Space Technology, Beijing Spacecrafts Manufacturing Factory , Beijing, China
93
天
Nanocopper-based low-temperature interconnection technology: advances in material systems, sintering mechanisms and packaging applications
作者Tian, Ye; Chen, Haojie; Ma, Lushan; Wang, Chao; Li, Ziqiang; Ma, Lei; Dong, Yongfeng; Chen, Xing
作者单位1. School of Mechanical and Electrical Engineering, Henan University of Technology , Zhengzhou, China; 2. School of Chemistry and Chemical Engineering, Henan University of Technology , Zhengzhou, China; 3. Ginkgo Semiconductor Co., Ltd , Zhuhai, China; 4. School of Material Science and Engineering, Henan University of Technology , Zhengzhou, China
171
天
36
天
Influence of electron irradiation on the power cycling lifetime of SiC MOSFETs
作者Yuxiong Xue; Jiayan Li; Bo Mei; Zhichao Wei; Zicai Shen; Liming Gu; Teng Zhang; Weixiang Zhou; Hanxun Liu; Dan Han; Rongxing Cao
作者单位1. Yangzhou University College of Electrical, Energy and Power Engineering, , Yangzhou,; 2. China Academy of Space Technology , Beijing,; 3. Beijing Institute of Spacecraft Environment Engineering , Beijing,; 4. Nanjing Electronic Devices Institute , Nanjing,; 5. Yangzhou University , Yangzhou,
107
天
Mechanical response of BGA micro solder joints with different shape combinations under thermal cycling
作者Xiangxia Kong; Zuchen Liu; Lu Yang; Ruipeng Ma; Junjun Zhai
作者单位1. North China Institute of Aerospace Engineering Department of Material Engineering, , Langfang,; 2. North China Institute of Aerospace Engineering Department of Aeronautics and Astronautics, , Langfang,
64
天
Reliability study of large-area sintered Cu for power electronic packaging
作者Yi Xie; Jian Huang; Daoguo Yang; Miao Cai; Hongbo Qin; Zhi Liang
作者单位1. Guilin University of Electronic Technology Guangxi Key Laboratory of Advanced Packaging and System Integration, School of Mechanical and Electrical Engineering, , Guilin,; 2. Guilin University of Electronic Technology Key Laboratory of Microelectronic Packaging & Assembly Technology of Guangxi, Department of Education, School of Mechanical and Electrical Engineering, , Guilin,; 3. Guilin University of Electronic Technology Guilin Xinyi Semiconductor Technology Co., Ltd, Guangxi Key Laboratory of Advanced Packaging and System Integration, School of Mechanical and Electrical Engineering, , Guilin,
55
天
Machine learning in solder joint engineering: a review of microstructure informatics, reliability prediction, and accelerated design
作者Muhammad Nubli Zulkifli
作者单位1. Universiti Kuala Lumpur Electrical Engineering Section, Renewable Energy Research Laboratory, British Malaysia Institute, , Kuala Lumpur,
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样本口径2026 年最近 5 篇有效论文样本
平均审稿96.4 天
中位数77 天