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SOLDERING & SURFACE MOUNT TECHNOLOGY
数据更新 2026-07-16 · 完整周期 10 篇 · 日期来源可逐条复核
SOLDERING & SURFACE MOUNT TECHNOLOGY已收录10篇完整论文周期样本，平均审稿75.8 天，中位审稿71 天。2025中科院4区，非OA，2025发文量28。页面含论文收到日期、录用日期、PDF、DOI和出版社网页溯源入口。
Latest Papers
最新发表论文审稿周期
审稿天数=录用日期-收到日期；保留 PDF/DOI/网页源链接
33
天
Corrosion and hardness properties of SAC305/Cu solder joint by microwave hybrid heating
作者Uzair Naeem; Ow Guan Yi; Enis Nadia Md Yusof; Mohd Azli Salim; Anvar Makhkamov; Adil Alshoaibi; Dawei Wang; Ahmad Azmin Mohamad
作者单位1. Universiti Sains Malaysia Energy Materials Research Group (EMRG), School of Materials and Mineral Resources Engineering, , Nibong Tebal,; 2. Universiti Sains Malaysia Chemical Sciences Programme, School of Distance Education, , Minden,; 3. Universiti Teknikal Malaysia Melaka Fakulti Teknologi dan Kejuruteraan Mekanikal, , Durian Tunggal,; 4. Namangan State Technical University Department of Technological Machines and Equipment, , Namangan,; 5. King Faisal University Department of Physics, College of Science, , Hofuf,; 6. Harbin Institute of Technology School of Instrumentation Science and Engineering, , Harbin,; 7. Universiti Sains Malaysia Energy Materials Research Group (EMRG), School of Materials and Mineral Resources Engineering, , Nibong Tebal, , and Department of Chemical Engineering, Faculty of Engineering, Chulalongkorn University, Bangkok, Thailand
78
天
93
天
Nanocopper-based low-temperature interconnection technology: advances in material systems, sintering mechanisms and packaging applications
作者Ye Tian; Haojie Chen; Lushan Ma; Chao Wang; Ziqiang Li; Lei Ma; Yongfeng Dong; Xing Chen
作者单位1. Henan University of Technology School of Mechanical and Electrical Engineering, , Zhengzhou,; 2. Henan University of Technology School of Chemistry and Chemical Engineering, , Zhengzhou,; 3. Ginkgo Semiconductor Co., Ltd , Zhuhai,; 4. Henan University of Technology School of Material Science and Engineering, , Zhengzhou,
171
天
36
天
Influence of electron irradiation on the power cycling lifetime of SiC MOSFETs
作者Yuxiong Xue; Jiayan Li; Bo Mei; Zhichao Wei; Zicai Shen; Liming Gu; Teng Zhang; Weixiang Zhou; Hanxun Liu; Dan Han; Rongxing Cao
作者单位1. Yangzhou University College of Electrical, Energy and Power Engineering, , Yangzhou,; 2. China Academy of Space Technology , Beijing,; 3. Beijing Institute of Spacecraft Environment Engineering , Beijing,; 4. Nanjing Electronic Devices Institute , Nanjing,; 5. Yangzhou University , Yangzhou,
107
天
Mechanical response of BGA micro solder joints with different shape combinations under thermal cycling
作者Xiangxia Kong; Zuchen Liu; Lu Yang; Ruipeng Ma; Junjun Zhai
作者单位1. North China Institute of Aerospace Engineering Department of Material Engineering, , Langfang,; 2. North China Institute of Aerospace Engineering Department of Aeronautics and Astronautics, , Langfang,
64
天
Reliability study of large-area sintered Cu for power electronic packaging
作者Yi Xie; Jian Huang; Daoguo Yang; Miao Cai; Hongbo Qin; Zhi Liang
作者单位1. Guilin University of Electronic Technology Guangxi Key Laboratory of Advanced Packaging and System Integration, School of Mechanical and Electrical Engineering, , Guilin,; 2. Guilin University of Electronic Technology Key Laboratory of Microelectronic Packaging & Assembly Technology of Guangxi, Department of Education, School of Mechanical and Electrical Engineering, , Guilin,; 3. Guilin University of Electronic Technology Guilin Xinyi Semiconductor Technology Co., Ltd, Guangxi Key Laboratory of Advanced Packaging and System Integration, School of Mechanical and Electrical Engineering, , Guilin,
55
天
Machine learning in solder joint engineering: a review of microstructure informatics, reliability prediction, and accelerated design
作者Muhammad Nubli Zulkifli
作者单位1. Universiti Kuala Lumpur Electrical Engineering Section, Renewable Energy Research Laboratory, British Malaysia Institute, , Kuala Lumpur,
99
天
Simulation and structural optimization of key structural mechanical properties of TR modules with quasi-coaxial structure under high-impact loads
作者Zhuo Chen; Zhiheng Luo; Junqin Zhang; Jie Li; Mingyu Gao; Qin Che; Jiayi Zhang
作者单位1. East China Institute of Photo-Electronic IC , Jiangsu,; 2. Xidian University , Xian,
22
天
AI-Driven cross-scale modeling for SiP thermo-mechanical simulation
作者Ce Zeng; Yanming Zhang; Mingqi Gao; Can Sheng; Dongyang Lei; Yang Li; Yangyang Li; Zhenduo Cui; Shengli Zhu
作者单位1. Tianjin University School of Materials Science and Engineering, , Tianjin, , and Microwave Circuits Integration Center, CETC 29th Research Institute, Chengdu, China; 2. CETC 29th Research Institute Department of Microwave Integration Center, , Chengdu,; 3. UESTC School of Materials and Energy, , Chengdu, , and Department of Microwave Integration Center, CETC 29th Research Institute, Chengdu, China; 4. Tianjin University School of Materials Science and Engineering, , Tianjin,