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Review Cycle Records

MICROELECTRONIC ENGINEERING

Elsevier SCIE 非OA
2026新锐 3区2025中科院 3区2025 JCR Q2
161平均天数
196中位天数
2最短天数
323最长天数
822025发文量

Paper Review Records

全部论文审稿周期

17 篇有效样本 · 按发表日期由新到旧排列
审稿天数=录用日期-收稿日期;保留 PDF/DOI/网页源链接

322 天

Modified compact modeling of tunnel diodes and its applications in ternary logic circuits

作者Jingyi Liu; Guangchao Zhao; Philippe Coquet; Mingqiang Huang; Xingli Wang; Beng Kang Tay

作者单位Centre for Micro-&Nano-Electronics, School of Electrical and Electronic Engineering, Nanyang Technological University, 639798, Singapore; CNRS International-NTU-Thales Research Alliance (CINTRA) / IRL 3288, Nanyang Technological University, 637553, Singapore; Institut d'Electronique, de Microélectronique et de Nanotechnologie (IEMN), CNRS UMR 8520—Université de Lille, France; School of Artificial Intelligence, Wuhan University, 430072, PR China

PDF源文件 DOI 网页
323 天

Design of temperature resistant dual band VCO with integrated TFC circuit for studying aging affect using machine learning framework

作者Susankar Borgohain; Khrishtina Dutta; Rashmi Choudhury; Ruchira Mazumdar; Niranjan Jyoti Borah; Pranab Kishore Dutta; Mriganka Gogoi

作者单位Department of Electronics and Telecommunication Engineering, Assam Engineering College, India; North Eastern Regional Institute of Science and Technology, Assam Don Bosco University, India

PDF源文件 DOI 网页
309 天

Ultra-low power electronics with steep sub-threshold swing devices, ferroelectric materials, and cryogenic operation

作者Darsen D. Lu; Hao-Yu Lu; Chia-Chi Hsieh; Ting-Yin Huang; Sourav De; Yao-Jen Lee; Kuo-Hsing Kao; Meng-Hsueh Chiang; Yeong-Her Wang

作者单位Department of Electrical Engineering, National Cheng Kung University, Tainan City, Taiwan; Miin Wu School of Computing, National Cheng Kung University, Tainan City, Taiwan; College of Semiconductor Research, National Tsing Hua University, Hsinchu, Taiwan; Inst. of Pioneer Semiconductor Innovation, National Yang Ming Chiao Tung Univ., Hsinchu, Taiwan

PDF源文件 DOI 网页
54 天

Pt redistribution in Ni(Pt)Si layers obtained via total vs. partial reactions and its impact on specific contact resistivity

作者Sophie Guillemin; Lillà Ferreint-Roselli; Patrice Gergaud; Nicolas Bernier; Isabelle Tinti; Cédric Bomme; Nicolas Gauthier; Philippe Rodriguez

作者单位Univ. Grenoble Alpes, CEA, Leti, F-38000 Grenoble, France

PDF源文件 DOI 网页
196 天

Logic and SRAM design co-optimization for A7 monolithic CFETs using backside gate contact-enabled hybrid power delivery

作者Hao He; Lijun Xu; Xiaoning Ma; Kunlong An; Yuntian Jia; Yajia Zhang; Zhiqiang Li; Jianyun Liu; He Cao; Zhenhua Wu; Qinzhi Xu

作者单位State Key Lab of Fabrication Technologies for Integrated Circuits, EDA Center, Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China; School of Integrated Circuits, University of Chinese Academy of Sciences, Beijing, 100049, China; School of Physics, Zhejiang University, Hangzhou, 310000, China

PDF源文件 DOI 网页
50 天

High-robustness and high-density VCMA-MRAM with energy-efficient BL-write scheme

作者Yaling Wang; Chao Wang; Jiaxin Li; Xiaoyang Xu; Hanbin Wang; Mingche Li; Weimeng Zhao; Zhongzhen Tong; Bi Wang; Zhaohao Wang

作者单位School of Integrated Circuit Science and Engineering, Beihang University, China; Hangzhou International Innovation Institute, Beihang University, China

PDF源文件 DOI 网页
5 天

Challenges in Cu PVD optimization for high-aspect-ratio via metallization

作者Hugo Nuez; Alice De Sousa Martins; Magali Gregoire; Rodolphe Bancheri; Julie Loche; Nassere Dine Hamdani

作者单位STMicroelectronics, 850 Rue Jean Monnet, 38926 Crolles Cedex, France

PDF源文件 DOI 网页
2 天

Understanding the impact of vdW gap on the reliability of nanoscale MoS2 FETs by TCAD modeling

作者Yezhu Lv; Yehao Wu; Yury Yu. Illarionov

作者单位Laboratory of 2D Optoelectronics and Nanoelectronics (L2DON), State Key Laboratory of Quantum Functional Materials, Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen, China

PDF源文件 DOI 网页
42 天

40 nm-thick Pt/(Al0.9Sc0.1)N/Pt ferroelectric capacitor stacks for logic-embedded memory on 300 mm Si with wafer-scale uniformity and process stability

作者Soshun Doko; Naoko Matsui; Toshikazu Irisawa; Koji Tsunekawa; Kazuki Okamoto; Hiroshi Funakubo

作者单位Canon ANELVA Corporation, Kawasaki, Kanagawa 215-8550, Japan; Department of Material Science and Engineering, School of Materials and Chemical Technology, Institute of Science Tokyo, Yokohama, Kanagawa 226-8501, Japan; MDX Research Center for Element Strategy, International Research Frontiers Initiative, Institute of Science Tokyo, Yokohama, Kanagawa 226-8501, Japan

PDF源文件 DOI 网页
105 天

LWR-driven hot carrier degradation-induced variability in CMOS devices: mechanisms and mitigation

作者Yaoting Wang; Yongyu Wu; Hai Wang; Zenan Wang; Dawei Gao; Kai Xu

作者单位College of integrated circuits, Zhejiang University, Hangzhou, Zhejiang, CO 311200, China; Zhejiang ICsprout Semiconductor Company Ltd., Hangzhou 311200, China.; ZJU-Hangzhou Global Scientific and Technological Innovation Center, Hangzhou, Zhejiang, CO 311200, China; Zhejiang Technology Innovation Center of CMOS IC Manufacturing Process and Design, Hangzhou, Zhejiang, CO 311200, China

PDF源文件 DOI 网页

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我是环境工程专业,需要一篇 SCI,希望 3 个月内见刊。没有基金,也没有大牛挂名,可以投哪些期刊?

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拟题建议
《融合机器学习与生命周期评价的城市污水处理碳排放预测与优化》

样本口径2026 年最近 5 篇有效论文样本

平均审稿96.4 天

中位数77 天

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