Paper Review Records
All Paper Review Records
15 valid samples · Newest publication first
Review days = acceptance date − received date. PDF, DOI, and publisher-page sources are retained.
42
days
Effects of Ag and Sb on bulk and interfacial stabilization in near-eutectic Sn-Bi-Ag-Sb/Cu solder joints during thermal aging
Authors
Yun-Hsin Cheng; Yu-chen LiuShow moreShow less
Affiliations
Department of Mechanical Engineering, National Cheng Kung University, Tainan, 70101, Taiwan; Program on Semiconductor Packaging and Testing, Academy of Innovative Semiconductor and Sustainable Manufacturing, National Cheng Kung University, Tainan, 70101, Taiwan; Program on Smart and Sustainable Manufacturing, Academy of Innovative Semiconductor and Sustainable Manufacturing, National Cheng Kung University, Tainan, 70101, Taiwan; Core Facility Center, National Cheng Kung University, Tainan, 70101, TaiwanShow moreShow less
100
days
Multi-electrolyte evaluation of binary CuO/TiO2 nanocomposites enabling versatile asymmetric supercapacitor applications
Authors
S. Harini; A. Sherin steenaShow moreShow less
Affiliations
Department of Physics, Loyola College, Chennai, 600034, IndiaShow moreShow less
74
days
Superior high-temperature oxidation resistance of plasma-sprayed Y-Hf doped high-entropy AlCoCrFeNi overlay coating
Authors
Litong Yang; Yongang Zhang; Xinyi Dong; Dongting Wu; Yong ZouShow moreShow less
Affiliations
Key Laboratory for Liquid-Solid Structural Evolution and Processing of Materials, Ministry of Education, School of Materials Science and Engineering, Shandong University, Jinan, 250061, PR ChinaShow moreShow less
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