Paper Review Records
全部论文审稿周期
15 篇有效样本 · 按发表日期由新到旧排列
审稿天数=录用日期-收稿日期;保留 PDF/DOI/网页源链接
42
天
Effects of Ag and Sb on bulk and interfacial stabilization in near-eutectic Sn-Bi-Ag-Sb/Cu solder joints during thermal aging
作者
Yun-Hsin Cheng; Yu-chen Liu展开收起
作者单位
Department of Mechanical Engineering, National Cheng Kung University, Tainan, 70101, Taiwan; Program on Semiconductor Packaging and Testing, Academy of Innovative Semiconductor and Sustainable Manufacturing, National Cheng Kung University, Tainan, 70101, Taiwan; Program on Smart and Sustainable Manufacturing, Academy of Innovative Semiconductor and Sustainable Manufacturing, National Cheng Kung University, Tainan, 70101, Taiwan; Core Facility Center, National Cheng Kung University, Tainan, 70101, Taiwan展开收起
100
天
74
天
Superior high-temperature oxidation resistance of plasma-sprayed Y-Hf doped high-entropy AlCoCrFeNi overlay coating
作者
Litong Yang; Yongang Zhang; Xinyi Dong; Dongting Wu; Yong Zou展开收起
作者单位
Key Laboratory for Liquid-Solid Structural Evolution and Processing of Materials, Ministry of Education, School of Materials Science and Engineering, Shandong University, Jinan, 250061, PR China展开收起
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