ACM Transactions on Reconfigurable Technology and Systems

作者Mohamed A. Elgammal; Jamie Wu; Lynne Liu; Taehoon Kim; Vaughn Betz

作者单位1. Electrical and Computer Engineering Department, University of Toronto, Canada

作者Adam H. Ross; Vairavan Palaniappan; Debjit Pal

作者单位1. Electrical and Computer Eng. Dept, University of Illinois Chicago, USA

作者Jan-Frederik Schulte; Benjamin Ramhorst; Chang Sun; Jovan Mitrevski; Nicolò Ghielmetti; Enrico Lupi; Dimitrios Danopoulos; Vladimir Lončar; Javier Duarte; David Burnette; Lauri Laatu; Stylianos Tzelepis; Konstantinos Axiotis; Quentin Berthet; Haoyan Wang; Paul White; Suleyman Demirsoy; Marco Colombo; Thea Klaeboe Aarrestad; Sioni Summers; Maurizio Pierini; Giuseppe Di Guglielmo; Jennifer Ngadiuba; Javier Campos; Benjamin Hawks; Abhijith Gandrakota; Farah Fahim; Nhan Tran; George A Constantinides; Zhiqiang Que; Wayne Luk; Alexander Tapper; Duc Hoang; Noah Paladino; Philip C. Harris; Bo-Cheng Lai; Manuel Valentin; Ryan Forelli; Seda Ogrenci; Lino Gerlach; Rian Brooks Flynn; Mia Liu; Daniel Diaz; Elham E. Koda; Melissa Quinnan; Russell Marroquin Solares; Santosh Parajuli; Mark S. Neubauer; Christian Herwig; Ho Fung Tsoi; Dylan Rankin; Shih-Chieh Hsu; Scott Hauck

作者单位1. Purdue University, West Lafayette, Indiana, USA; 2. ETH Zurich, Zurich, Switzerland; 3. California Institute of Technology, Pasadena, California, USA; 4. Fermi National Accelerator Laboratory, Batavia, Illinois, USA; 5. European Organization for Nuclear Research (CERN), Geneva, Switzerland; 6. European Organization for Nuclear Research (CERN), Geneva, Switzerland and Institute of Physics Belgrade, Belgrade, Serbia; 7. University of California San Diego, La Jolla, California, USA; 8. Siemens EDA, Wilsonville, Oregon, USA; 9. Imperial College London, London, United Kingdom of Great Britain and Northern Ireland; 10. National Technical University of Athens, Zografou, Greece; 11. University of Geneva, Geneva, Switzerland; 12. University of Geneva, Geneva, Switzerland and University of Applied Sciences and Arts Western Switzerland, Delémont, Switzerland; 13. Altera Corporation, San Jose, California, USA; 14. Discovery Partners Institute, Chicago, USA; 15. Massachusetts Institute of Technology, Cambridge, Massachusetts, USA; 16. National Yang Ming Chiao Tung University, Hsinchu, Taiwan; 17. Northwestern University, Evanston, Illinois, USA; 18. Northwestern University, Evanston, Illinois, USA, USA; 19. Princeton University, Princeton, New Jersey, USA; 20. University of Illinois Urbana-Champaign, Urbana, Illinois, USA; 21. University of Michigan, Ann Arbor, Michigan, USA; 22. University of Pennsylvania, Philadelphia, Pennsylvania, USA; 23. University of Washington, Seattle, Washington, USA

作者Antonio Filgueras; Ismael el Basli; Juan Miguel de Haro Ruiz; Miquel Vidal; Carlos Álvarez; Daniel Jiménez-González; Xavier Martorell

作者单位1. Universitat Politècnica de Catalunya, Barcelona, Spain and Barcelona Supercomputing Center, Barcelona, Spain; 2. Universitat Politècnica de Catalunya, Barcelona, Spain; 3. Barcelona Supercomputing Center, Barcelona, Spain

作者Topi Leppänen; Leevi Leppänen; Zainab Jamil; Jan Solanti; Joonas Multanen; Pekka Jääskeläinen

作者单位1. Faculty of Information Technology and Communication Sciences (ITC), Tampere University, Tampere, Finland

作者Sebastian Wittlich; Hendrik Wöhrle; Tobias Krawutschke

作者单位1. University of Duisburg-Essen, Duisburg, Germany, and Institute of Computer and Communication Technology, Cologne University of Applied Sciences, Cologne, Germany; 2. University of Duisburg-Essen, Duisburg, Germany, and Fraunhofer Institute for Microelectronic Circuits and Systems IMS, Duisburg, Germany; 3. Institute of Computer and Communication Technology, University of Applied Science Cologne, Cologne, Germany

作者Yaman Umuroglu; Christoph Berganski; Felix Jentzsch; Michal Danilowicz; Tomasz Kryjak; Charalampos Bezaitis; Magnus Själander; Ian Colbert; Thomas Preusser; Jakoba Petri-Koenig; Michaela Blott

作者单位1. AMD Research, Trondheim, Norway and Norwegian University of Science and Technology, Trondheim, Norway; 2. Paderborn University, Paderborn, Germany; 3. AGH University of Krakow, Krakow, Poland; 4. Norwegian University of Science and Technology, Trondheim, Norway; 5. AMD, San Jose, California, USA; 6. AMD Research, Dresden, Germany; 7. AMD Research, Dublin, Ireland