Nature Electronics

AuthorsByungsoo Kim; Soo Ho Choi; Georgii Zograf; Young Jin Yoo; Yongmin Baek; Seokho Kim; Jongchan Kim; Jeehwan Kim; Sang Hoon Chae; Hyunseok Kim; Seunghoon Hong; Kyusang Lee

Affiliations1. Department of Electrical and Computer Engineering, University of Virginia, Charlottesville, USA; 2. School of Electrical and Electronic Engineering, Yonsei University, Seoul, Republic of Korea; 3. Department of Integrated Display Engineering, Yonsei University, Seoul, Republic of Korea; 4. Department of Electrical and Computer Engineering, University of Illinois Urbana-Champaign, Urbana, USA; 5. School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore, Singapore; 6. School of Materials Science and Engineering, Nanyang Technological University, Singapore, Singapore; 7. Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, USA; 8. AI Infra Optimization Team, SK hynix Inc., Seoul, Republic of Korea; 9. Department of Material Science and Engineering, University of Virginia, Charlottesville, USA

AuthorsJeong-Wan Jo; Yoonwoo Kim; Sanghyo Lee; Jiajie Yang; Yaron Bernstein; Giovanni Francesco Cotella; Feng Zhao; Quan Lyu; Thomas E. Davies; Faris Abualnaja; Greg Chu; Hannah J. Joyce; Stephan Hofmann; Jack A. Alexander-Webber; Bo Hou; Sung-Min Jung; Gehan A. J. Amaratunga; Jong Min Kim

Affiliations1. Electrical Engineering Division, Department of Engineering, University of Cambridge, Cambridge, UK; 2. Department of Electronics Engineering, Incheon National University, Incheon, Republic of Korea; 3. Department of Materials and Science, Kumoh National Institute of Technology, Gumi, Republic of Korea; 4. Huawei Technologies Research and Development, Ipswich, UK; 5. Huawei Technologies, Shenzhen, China; 6. Huawei Technologies Research and Development, Cambridge, UK; 7. School of Chemistry, Cardiff University, Cardiff, UK; 8. Department of Electrical Engineering, King Fahd University of Petroleum and Minerals, Dhahran, Saudi Arabia; 9. Department of Materials, Loughborough University, Loughborough, UK; 10. School of Physics and Astronomy, Cardiff University, Cardiff, UK; 11. AllFocal Optics, St John’s Innovation Centre, Cambridge, UK; 12. Institute of Critical Materials in Integrated Circuits, Shenzhen Polytechnic University, Shenzhen, China

AuthorsShuangming Yang; Jianshi Tang; Tianhang Zhou; Bernabe Linares-Barranco; Giacomo Indiveri; Xinhu Zheng; Mostafa Rahimi Azghadi; Badong Chen

Affiliations1. School of Electrical and Information Engineering, Tianjin University, Tianjin, China; 2. School of Integrated Circuits, Tsinghua University, Beijing, China; 3. Instituto de Microelectrónica de Sevilla (IMSE-CNM, CSIC), Seville, Spain; 4. Institute of Neuroinformatics, University of Zurich and ETH Zurich, Zurich, Switzerland; 5. Internet of Things Thrust and Intelligent Transportation Thrust, The Hong Kong University of Science and Technology (Guangzhou), Guangzhou, China; 6. College of Science and Engineering, James Cook University, Townsville, Australia; 7. State Key Laboratory of Human-Machine Hybrid Augmented Intelligence, Institute of Artificial Intelligence and Robotics, Xi’an Jiaotong University, Xi’an, China

AuthorsShengqi Wang; Peigen Zhang; Yongping Dai; Jing He; Jifeng Ge; Junying Xue; Wenjie Li; Ruihao Tan; Tingyi Xia; Yanming Liu; He Tian; Zhaoyang Lin

Affiliations1. Department of Chemistry, Engineering Research Center of Advanced Rare Earth Materials (Ministry of Education), Tsinghua University, Beijing, China; 2. School of Integrated Circuits & Beijing National Research Center for Information Science and Technology (BNRist), Tsinghua University, Beijing, China

AuthorsErnest Y. Wu; Tibor Grasser; Mario Lanza

Affiliations1. IBM Research Division, Essex Junction, USA; 2. University of Vermont, Burlington, USA; 3. Institute for Microelectronics, TU Wien, Vienna, Austria; 4. Department of Materials Science and Engineering, National University of Singapore, Singapore, Singapore; 5. Institute for Functional Intelligent Materials, National University of Singapore, Singapore, Singapore

AuthorsSubir Ghosh; Pranavram Venkatram; Harikrishnan Ravichandran; Rishikesh T. Nair; Yongwen Sun; Lei Ding; Chen Chen; Joan M. Redwing; Yang Yang; Saptarshi Das

Affiliations1. Engineering Science and Mechanics, Penn State University, University Park, USA; 2. Electrical Engineering, Penn State University, University Park, USA; 3. 2D Crystal Consortium Materials Innovation Platform, Penn State University, University Park, USA; 4. Materials Science and Engineering, Penn State University, University Park, USA; 5. Materials Research Institute, Penn State University, University Park, USA; 6. Nuclear Engineering, Penn State University, University Park, USA

AuthorsPierre Hamonic; Mathieu Toubeix; Guillermo Haas; Jayshankar Nath; Matthieu C. Dartiailh; Biel Martinez; Benoit Bertrand; Heimanu Niebojewski; Maud Vinet; Christopher Bäuerle; Franck Balestro; Tristan Meunier; Matias Urdampilleta

Affiliations1. Institut Néel, Université Grenoble Alpes, CNRS, Grenoble INP, Grenoble, France; 2. CEA-List, Université Grenoble Alpes, Grenoble, France; 3. Quobly, Grenoble, France; 4. CEA-Leti, Université Grenoble Alpes, Grenoble, France

AuthorsWoo-Bin Jung; Han Sae Jung; Jun Wang; Henry Hinton; Seok Joo Kim; Yuchang Zhang; Suyue Chen; Young-Ha Hwang; Maxime Fournier; Manon Boul; Kevin Grosselin; Adrian Horgan; Xavier Godron; Robert Nicol; Donhee Ham

Affiliations1. John A. Paulson School of Engineering and Applied Sciences, Harvard University, Cambridge, USA; 2. Department of Chemical Engineering, Pohang University of Science and Technology, Pohang, Republic of Korea; 3. Department of Electrical and Computer Engineering, Virginia Tech, Blacksburg, USA; 4. DNA Script, Le Kremlin-Bicêtre, France; 5. Broad Institute of MIT and Harvard, Cambridge, USA; 6. School of Electronic Engineering and Department of Intelligent Semiconductors, Soongsil University, Seoul, Republic of Korea; 7. Skyhook Bio, Cambridge, USA; 8. RA Ventures, Boston, USA

AuthorsYifeng Xiong; Shaochen Fang; Yining Xu; Yu Lei; Lingyi Ao; Liuwei Zhan; Zixuan Ding; Hengtian Zhu; Maojie Chen; Zeya Li; Wencai Ren; Jinhui Chen; Ye Chen; Yan-qing Lu; Hongtao Yuan; Fei Xu

Affiliations1. National Laboratory of Solid State Microstructures, College of Engineering and Applied Sciences, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China; 2. Shenzhen Research Institute of Nanjing University, Shenzhen, China; 3. School of Microelectronics and Data Science, Anhui University of Technology, Maanshan, China; 4. Quantum Science Center of Guangdong-Hong Kong-Macao Greater Bay Area, Shenzhen, China; 5. Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang, China; 6. Institute of Electromagnetics and Acoustics, Xiamen University, Xiamen, China; 7. College of Physics, MIIT Key Laboratory of Aerospace Information Materials and Physics, Nanjing University of Aeronautics and Astronautics, Nanjing, China; 8. Jiangsu Key Laboratory of Artificial Functional Materials, Nanjing, China

AuthorsJong Uk Kim; Seung Gi Seo; Hongkai Wang; Eric Rytkin; Jiarui Gong; Jie Zhou; Junhwan Choi; Jiwon Kim; Sun Young Park; Anna Pfenniger; Rishi K. Arora; Aleksei Mikhailov; Jinheon Jeong; Seungyeob Kim; Yamin Zhang; Ravi F. Nuxoll; Hak-Young Ahn; Geumbee Lee; Shupeng Li; Dae-Hyeon Song; Sangwon Cha; Young Jin Jo; Sang Min Won; Tae-il Kim; Yei Hwan Jung; Sumanas W. Jordan; Yonggang Huang; Jae-Young Yoo; Igor R. Efimov; Colin K. Franz; Zhenqiang Ma; Sung Hun Jin; John A. Rogers

Affiliations1. Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, USA; 2. School of Chemical Engineering, Sungkyunkwan University, Suwon, Republic of Korea; 3. School of Electronic Engineering, Kumoh National Institute of Technology, Gumi, Republic of Korea; 4. Regenerative Neurorehabilitation Laboratory, Shirley Ryan AbilityLab, Chicago, USA; 5. Department of Biomedical Engineering, Northwestern University, Evanston, USA; 6. Department of Electrical and Computer Engineering, University of Wisconsin-Madison, Madison, USA; 7. Department of Electrical and Computer Engineering, Texas A&M University, College Station, USA; 8. Department of Electrical and Computer Engineering, The University of Texas at Dallas, Richardson, USA; 9. Department of Chemical Engineering, Dankook University, Yongin, Republic of Korea; 10. Department of Foundry Engineering, Dankook University, Yongin, Republic of Korea; 11. Department of Electronic Engineering, Hanyang University, Seoul, Republic of Korea; 12. Feinberg Cardiovascular and Renal Research Institute, Feinberg School of Medicine, Northwestern University, Chicago, USA; 13. Biological Sciences Division, Department of Medicine, University of Chicago, Chicago, USA; 14. Weldon School of Biomedical Engineering, Purdue University, West Lafayette, USA; 15. Elmore Family School of Electrical and Computer Engineering, Purdue University, West Lafayette, USA; 16. School of Electrical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea; 17. Department of Chemical and Biomolecular Engineering, College of Design and Engineering, National University of Singapore, Singapore, Singapore; 18. Department of Materials Science and Engineering, Northwestern University, Evanston, USA; 19. Department of Physics and Astronomy, Northwestern University, Evanston, USA; 20. Department of Chemical Engineering and Applied Chemistry, Kyungpook National University, Daegu, Republic of Korea; 21. Department of Civil and Environmental Engineering, Northwestern University, Evanston, USA; 22. Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea; 23. Department of Electrical and Computer Engineering, University of Southern California, Los Angeles, USA; 24. Department of Electrical and Computer Engineering, Sungkyunkwan University, Suwon, Republic of Korea; 25. Division of Plastic and Reconstructive Surgery, Department of Surgery, Northwestern University Feinberg School of Medicine, Chicago, USA; 26. Biologics Laboratory, Shirley Ryan AbilityLab, Chicago, USA; 27. Department of Mechanical Engineering, Northwestern University, Evanston, USA; 28. Department of Semiconductor Convergence Engineering, Sungkyunkwan University, Suwon, Republic of Korea; 29. Department of Medicine, Northwestern University, Chicago, USA; 30. Department of Physical Medicine and Rehabilitation, Feinberg School of Medicine, Northwestern University, Chicago, USA; 31. Ken and Ruth Davee Department of Neurology, Feinberg School of Medicine, Northwestern University, Chicago, USA; 32. Department of Medicine (Pulmonary and Critical Care), Feinberg School of Medicine, Northwestern University, Chicago, USA; 33. Department of Physical Therapy and Human Movement Sciences, Feinberg School of Medicine, Northwestern University, Chicago, USA; 34. Department of Information Display, Kyung Hee University, Seoul, Republic of Korea; 35. Department of Neurological Surgery, Feinberg School of Medicine, Northwestern University, Chicago, USA