Microsystems & Nanoengineering

AuthorsJunjun Lei; Li Lin; Feng Cheng; Peter Glynne-Jones; Martyn Hill; Zhigang Huang; Zhen Yao; Maodan Yuan

Affiliations1. State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, School of Electromechanical Engineering, Guangdong University of Technology, Guangzhou, China; 2. Guangdong Provincial Key Laboratory of Advanced Manufacturing Technology for Marine Energy Facilities, Guangdong University of Technology, Guangzhou, China; 3. Faculty of Engineering and Physical Sciences, University of Southampton, Southampton, UK

AuthorsSongfeng Huang; Yue Jiao; Yuye Wang; Xiaoqi Dai; Junkang Deng; Jiali Tai; Xiaorui Liu; Hailong Ni; Feiran Xie; Jiajie Chen; Junle Qu; Gaixia Xu; Yonghong Shao

Affiliations1. State Key Laboratory of Radio Frequency Heterogeneous Integration, Key Laboratory of Optoelectronic Devices and Systems of Ministry of Education and Guangdong Province, College of Physics and Optoelectronics Engineering, Shenzhen University, Shenzhen, China; 2. Guangdong Key Laboratory for Biomedical Measurements and Ultrasound Imaging, School of Biomedical Engineering, Shenzhen University Medical School, Shenzhen University, Shenzhen, Guangdong, China

AuthorsHunter Shillingburg; Daniel Lopez

Affiliations1. Electrical Engineering and Computer Science, Penn State University, 207 Electrical Engineering West, University Park, USA; 2. Materials Research Institute, Penn State University, University Park, USA

AuthorsDa-In Kwon; Yeong-Eun Yoo; Jae-Ho Jin; Ji Hyo Park; Ga Eun Han; Kwanoh Kim; Jae Sung Yoon; Seong Min Kang; Do Hyun Kang

Affiliations1. Nano-Lithography & Manufacturing Research Center, Korea Institute of Machinery and Materials (KIMM), Daejeon, South Korea; 2. Department of Mechanical Engineering, Sogang University, Seoul, South Korea; 3. Neo Nanotech Co., Ltd., Daejeon, South Korea; 4. Department of Chemistry, Chung-Ang University, Seoul, South Korea; 5. Advanced Bioconvergence, University of Science & Technology, Daejeon, South Korea

AuthorsDong Cheng; Zhenlong Huang; Tao Chen; Hongwei Xie; Longpeng Yang; Yizhuo Wang; Junjie Ji; Jing Liu; Yan Jiang; Tailong Wu; Tianyu Yan; Mingrui Chen; Hao Li; Binbin Jiang; Taisong Pan; Min Gao; Yuan Lin

Affiliations1. School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu, PR China; 2. Shenzhen Institute for Advanced Study, University of Electronic Science and Technology of China, Shenzhen, PR China; 3. Energy and Information Materials Key Laboratory of Sichuan Province, University of Electronic Science and Technology of China, Chengdu, PR China; 4. State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, PR China; 5. Medico-Engineering Cooperation on Applied Medicine Research Center, University of Electronic Science and Technology of China, Chengdu, PR China

AuthorsXu Guo; Jiehe Wang; Jintao Ni; Ye Jiang; Yajiang Yin; Wenshuai Lu; Bo Ma; Zheng You

Affiliations1. Microsystems Technology Research Center, School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan, China; 2. Department of Precision Instrument, Tsinghua University, Beijing, China

AuthorsCheng-Wen He; Xiaohuan Guo; Tao Liang; Pan Chen; Kaiqiang Li; Aibo Xu; Ke Hao; Ning Hu; Zhen Wang

Affiliations1. Laboratory Medicine Center, Allergy Center, Department of Transfusion Medicine, Zhejiang Provincial People’s Hospital, Affiliated People’s Hospital, Hangzhou Medical College, Hangzhou, China; 2. Department of Chemistry, Zhejiang-Israel Joint Laboratory of Self-Assembling Functional Materials, ZJU-Hangzhou Global Scientific and Technological Innovation Center, School of Medicine, Zhejiang University, Hangzhou, China; 3. General Surgery Department, Children’s Hospital, Zhejiang University School of Medicine, National Clinical Research Center for Children’s Health, Hangzhou, China; 4. State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China

AuthorsYimeng Jiang; Misheng Liang; Ying Xie; Ruige Su; Bo Wang; Fan Wu; Xiaomeng Bian; He Tian; Rui You

Affiliations1. Laboratory of the Intelligent Microsystem, Beijing Information Science and Technology University, Beijing, China; 2. School of Instrument Science and Opto-Electronics Engineering, Beijing Information Science and Technology University, Beijing, China; 3. AVIC Chengdu Aircraft Industry Group Co Ltd, Chengdu, China; 4. Institute of Medical Equipment Science and Engineering, Huazhong University of Science and Technology, Wuhan, China; 5. School of Integrated Circuit, Tsinghua University, Beijing, China

AuthorsTao Liu; Wenwu Yan; Dongxiao Li; Jidong Cai; Jian Feng; Hanjie Dou; Jiaqian Yang; Pengfan Wu; Hongliang Wang; Xiaojing Mu

Affiliations1. State key Laboratory of Extreme Environment Optoelectronic Dynamic Measurement Technology and Instrument, Science and Technology on Electronic Test and Measurement Laboratory, North University of China, Taiyuan, PR China; 2. Key Laboratory of Optoelectronic Technology & Systems Ministry of Education, International R & D center of Micro-nano Systems and New Materials Technology, Chongqing University, Chongqing, PR China

AuthorsFriederike-Leonie Born; Raphael Dezauzier; Annelies S. Zinkernagel; Petra S. Dittrich

Affiliations1. Department of Biosystems Science and Engineering, ETH Zurich, Basel, Switzerland; 2. Department of Infectious Diseases and Hospital Epidemiology, University Hospital Zurich, University of Zurich, Zurich, Switzerland