Engineering
Review Cycle Records
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY
Paper Review Records
All Paper Review Records
3 valid samples · Newest publication first
Review days = acceptance date − received date. PDF, DOI, and publisher-page sources are retained.
Reliability Analysis of IGZO Thin-Film Transistor for Wearable Biosensing Applications
AuthorsAnchal Thakur; Samriti Sharma; Jaya Madan; Rahul Pandey
Affiliations1. Chitkara University Institute of Engineering and Technology, Chitkara University, Rajpura, Punjab, India; 2. Department of Applied Physics, Delhi Technological University, Rohini, Delhi, India; 3. Centre for Research Impact and Outcome, Chitkara University Institute of Engineering and Technology, Chitkara University,, Rajpura, Punjab, India; 4. Department of Applied Sciences (Physics), National Institute of Technology Delhi, Narela, New Delhi, India
Avalanche Failure Mechanisms of 1200-V/40-A 4H-SiC Junction Barrier Schottky Diodes With Various Epilayer Defects
AuthorsJinlan Li; Yan Xu; Huaren Sheng; Quanzhi Chen; Ling Dong; Yiming Shi; Yulin Wang; Liming Zhou; Yuan Xu
Affiliations1. College of Information Engineering, Yangzhou University, Yangzhou, China; 2. Yangjie Electronic Technology Company Ltd., Yangzhou, China
Impact of Substrate Connection on Dynamic-R ON Drift of 650 V Normally-Off Monolithic Bidirectional AlGaN/GaN HEMT
AuthorsMarcello Cioni; Alessandro Chini; Giacomo Cappellini; Giovanni Giorgino; Nuri Said; Maurizio Moschetti; Cristina Miccoli; Tariq Wakrim; Alessandro Contarino; Adriano Abbisogni; Antonio Pizzardi; Santo Smerzi; Maria Eloisa Castagna; Aurore Constant; Ferdinando Iucolano
Affiliations1. STMicroelectronics, Catania, Italy; 2. Department of Engineering “Enzo Ferrari,”, Università degli Studi di Modena e Reggio Emilia, Modena, Italy; 3. STMicroelectronics, Tours, France
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