Engineering
Review Cycle Records
IEEE Transactions on Components Packaging and Manufacturing Technology
Paper Review Records
All Paper Review Records
3 valid samples · Newest publication first
Review days = acceptance date − received date. PDF, DOI, and publisher-page sources are retained.
Geometry Optimization of Nonideal Through-Glass Vias (TGVs) for Enhanced Electrical and Mechanical Performance
AuthorsZhen Fang; Jinxu Liu; Borui Li; Wenlei Li; Jihua Zhang
Affiliations1. State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China; 2. 3D Chips (Guangdong) Technology Company Ltd., Dongguan, China
Mechanistic Study on Regulating the Aspect Ratio of Silver Lines in Dry Aerosol Jet Printing via Focusing Ratio
AuthorsYi Zhang; Xiayun Shu; Sai Chen; Guangfu Qiu; Feilong Zhao; Hongyang Jiang; Shenghan Lin
Affiliations1. School of Mechanical and Automotive Engineering and Key Laboratory of Precision Drive and Transmission in Fujian Province, Xiamen University of Technology, Xiamen, China
Optimization of a Compact Manifold Heatsink in External Airflow for Power Devices Using a Multiobjective Genetic Algorithm
AuthorsWenguang Zhao; Gearóid Farrell; Rajesh Nimmagadda; Shailesh N. Joshi; Ercan. M. Dede; Tim Persoons
Affiliations1. Department of Mechanical, Manufacturing and Biomedical Engineering, Trinity College Dublin, Dublin, Ireland; 2. Toyota Research Institute of North America, Ann Arbor, MI, USA
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