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Conduction and convection analyses of flexible electronic devices via coupled thermo-elastic formulation and variable-fidelity beam models
作者R. Azzara; M. Filippi; A. Racionero Sánchez-Majano; E. Carrera
作者单位1. MUL; 2. , Department of Mechanical and Aerospace Engineering, Politecnico di Torino; 3. Department of Aerospace Engineering, Universidad Carlos III de Madrid
Analytical and finite element study of thermally-induced blow-up in nonlinear delayed wave systems for viscoelastic beams
作者Salim Adjemi; Fakhreddine Khrouf
作者单位1. Computer Science and Applied Mathematics Laboratory (LIMA), Chadli Bendjedid, El Tarf University; 2. Mechanical Engineering Department, Laboratory of Mechanics, Chaabet-Ersas Campus, Université Fréres Mentouri
Propagation of thermoelastic waves for a rotating semiconductor material subjected to laser beam and initial stress effect
作者Rania R. Yahya; A. M. Abd-Alla
作者单位1. Department of Mathematics, Faculty of Science, Tanta University; 2. Department of Mathematics, Faculty of Science, Sohag University
Thermoelastic contact behavior of functionally graded piezoelectric materials under conductive cylindrical punch
作者Xinyu Zhou; Kaiwen Xiao; Jing Liu; Jia-Jia Mao
作者单位1. College of Engineering, Huazhong Agricultural University; 2. Department of Mechanics, School of Mathematics, Statistics and Mechanics, Beijing University of Technology
Thermoelastic analysis of ellipsoidal particle-reinforced functionally graded materials, considering the boundary effects
作者Guanyi Zhang; Yifan Zhang; Liangliang Zhang; Yang Gao
作者单位1. College of Science, China Agricultural University; 2. State Key Laboratory of Simulation and Regulation of Water Cycle in River Basin, China Institute of Water Resources and Hydropower Research
Nonlocal thermodynamical interactions in a hyperbolic two-temperature transversely isotropic medium with diffusion and temperature dependent properties under Lord-Shulman model
作者Sonu Rani; Sunita Deswal; Sandeep Singh Sheoran
作者单位1. Department of Mathematics, Guru Jambheshwar University of Science and Technology
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