Paper Review Records
全部论文审稿周期
15 篇有效样本 · 按发表日期由新到旧排列
审稿天数=录用日期-收稿日期;保留 PDF/DOI/网页源链接
71
天
Femtosecond-pulsed laser and atmospheric pressure plasma jet pre-treatment for media resistant adhesive bonds on nickel
作者
Christoph J. A. Beier; Alexander Lutz; Kristof Marcoen; Zhen Lei; Maximilian K. Heym; Vinzenz Ginster; Kitty Baert; Tom Hauffman; Iris De Graeve; Alexander Schiebahn; Uwe Reisgen展开收起
作者单位
1. RWTH Aachen University; 2. Vrije Universiteit Brussel展开收起
65
天
Impact of preservative impregnation on wettability, surface free energy, and adhesive bonding of Scots pine CLT
作者
Hasan Öztürk; Aydın Demir; Abdullah Uğur Birinci; Okan İlhan; Ali Çakmak; Cenk Demirkır; Engin Derya Gezer展开收起
作者单位
1. Karadeniz Technical University; 2. HC Panel Forest Products Consulting Services Industry and Trade Limited Company展开收起
103
天
Strengthening the grid: hybrid-bonded bolted joints for retrofitting weathered power-line structures
作者
Tobias Evers; Till Vallée; Uwe Specht; Sascha Buchbach; Matthias Albiez; Jakob Boretzki; Marc Aurel Viehöfer展开收起
作者单位
1. Fraunhofer Institute for Manufacturing Technology and Advanced Materials IFAM; 2. Versuchsanstalt für Stahl, Holz und Steine, KIT Stahl- Und Leichtbau, Karlsruhe Institute of Technology展开收起
109
天
Numerical analysis of end-loaded split (ELS) test for mode II fracture characterization of structural adhesives
作者
J.M.A. Fontes; R.D.S.G. Campilho; K. Madani; K. Zouggar; F.J.G. Silva; L.D.C. Ramalho展开收起
作者单位
1. Polytechnic of Porto; 2. Rua Dr. Roberto Frias; 3. University of Sidi Bel Abbes展开收起
66
天
Nanoparticle-enhanced dental adhesives: improving dentin bond strength through multifunctional nanotechnology
作者
Suleiman Ibrahim Mohammad; Asokan Vasudevan; Lashin Saad Ali; Wenchang Chen展开收起
作者单位
1. Economic and Administrative Sciences Zarqa University; 2. INTI International University; 3. Shinawatra University; 4. Al-Ahliyya Amman University; 5. Guizhou Qiannan College of Science and Technology展开收起
111
天
Analysis of adhesive degradation mechanisms and strength prediction based on principal component analysis
作者
Daichi Yamaura; Kazumasa Shimamoto; Nao Terasaki; Haruhisa Akiyama展开收起
作者单位
1. Sensing Technology Research Institute (STRI); 2. Research Institute of Core Technology for Materials Innovation (CTMI)展开收起
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