SENSORS

作者Xindan Zhang; Yanping Xian; Guoshan He

作者单位1. Guangzhou Medical Devices Testing Center, Guangzhou Quality Testing & Inspection Institute, Guangzhou 511447, China

作者Momen Abayazid

作者单位1. Control and Instrumentation Engineering Department, King Fahd University of Petroleum and Minerals, P.O. Box 1816, Dhahran 31261, Saudi Arabia; 2. Interdisciplinary Research Center for BioSystems and Machines, King Fahd University of Petroleum and Minerals, P.O. Box 1816, Dhahran 31261, Saudi Arabia

作者Christoph Lange; Andreas Ahrens; Yadu Krishnan Krishnakumar; Denise Engert; Ming Yin

作者单位1. School of Engineering—Energy and Information, Hochschule für Technik und Wirtschaft Berlin (University of Applied Sciences), Wilhelminenhofstraße 75 A, 12459 Berlin, Germany; 2. Faculty of Engineering, Hochschule Wismar (University of Applied Sciences: Technology, Business and Design), Philipp-Müller-Straße 14, 23966 Wismar, Germany; 3. Escuela Técnica Superior de Ingeniería y Sistemas de Telecomunicación (ETSIST), Universidad Politécnica de Madrid, Campus Sur, Calle Nikola Tesla s/n, 28031 Madrid, Spain; 4. Telekom Innovation Laboratories, Deutsche Telekom, Winterfeldtstraße 21, 10781 Berlin, Germany

作者Abdulaziz Almuhini; Viji Ahanathapillai; Zeeshan Raza; Imran Aslam; Abhilasha Patel; Charles Evans; Leandro Pecchia; Davide Piaggio

作者单位1. Department of Biomedical Technology, College of Applied Medical Sciences in Al-Kharj, Prince Sattam bin Abdulaziz University, Al-Kharj 11942, Saudi Arabia; 2. Applied Biomedical Signal Processing and Intelligent eHealth (ABSPIE) Lab, School of Engineering, University of Warwick, Coventry CV4 7AL, UK; 3. Department of Colorectal Surgery, University Hospital Coventry and Warwickshire, Coventry CV2 2DX, UK; 4. School of Engineering, Università Campus Bio-Medico di Roma, Via Álvaro del Portillo, 00128 Rome, Italy

作者Bagathi Nithul; Kotaprolu Sai Smaran; Prabakaran Veerajagadheswar; Megalingam Rajesh Kannan; Rajesh Elara Mohan

作者单位1. Engineering Product Development Pillar, Singapore University of Technology and Design, Singapore 487372, Singapore; 2. Department of Electronics and Communication Engineering, Amrita Vishwa Vidyapeetham, Amritapuri 690525, India

作者Fabrice Simpore; Daniel Vargas; Tadiwa Aubrey Mugwadi; Abdullah Al Tasim; Collin Burch; Jason Ayubu Meshili; Labid Bin Bashar; Yasaman Hajnorouzali; Hanchen Wang; Bin Xu

作者单位1. School of Aerospace and Mechanical Engineering, University of Oklahoma, Norman, OK 73019, USA

作者Xinhong Yu; Haiyue Sun; Chu Zhang; Runqiu Wang; Shunda Qiao; Ying He; Yufei Ma

作者单位1. Zhengzhou Advanced Research Institute, Harbin Institute of Technology, Zhengzhou 450008, China; 2. National Key Laboratory of Laser Spatial Information, Harbin Institute of Technology, Harbin 150001, China

作者Haoyang Shi; Xuchun Zhang; Chuan Sheng; Lin Huang; Kun Wang; Xikang Li

作者单位1. Air Defense and Anti-Missile Academy, Air Force Engineering University, Xi’an 710051, China

作者Lei Wang; Zhiqiang Bai; Ruijie Han; Chaoxia Wu; Shengwei Mu

作者单位1. Henan Key Laboratory of Advanced Cable Materials and Intelligent Manufacturing, Henan Institute of Technology, Xinxiang 453003, China; 2. School of Materials Science and Engineering, Henan University of Technology, Zhengzhou 450007, China; 3. School of Computer Science and Information Engineering, Anyang Institute of Technology, Anyang 455000, China

作者Faizal Widya Nugraha; Thanda Shwe; Israel Mendonça; Masayoshi Aritsugi

作者单位1. Graduate School of Science and Technology, Kumamoto University, Kumamoto 860-8555, Japan; 2. Faculty of Advanced Science and Technology, Kumamoto University, Kumamoto 860-8555, Japan; 3. Research and Education Institute for Semiconductors and Informatics, Kumamoto University, Kumamoto 860-8555, Japan