Micromachines

作者Kailai Wang; Jiawei Li; Leilei Wang; Shishuang Zhang; Xu Zheng; Qilong Zheng; Haihang Cui

作者单位1. State Key Laboratory of Nonlinear Mechanics, Institute of Mechanics, Chinese Academy of Sciences, Beijing 100190, China; 2. School of Building Services Science and Engineering, Xi’an University of Architecture and Technology, Xi’an 710055, China; 3. Xi’an Modern Chemistry Research Institute, Xi’an 710065, China

作者He Yang; Baokai Huang; Wen Wang; Zhanfeng Chen; Keqing Lu

作者单位1. School of Aerospace Engineering and Applied Mechanics, Tongji University, Shanghai 200092, China; 2. Shanghai Key Lab of Vehicle Aerodynamics and Vehicle Thermal Management Systems, Shanghai 200092, China; 3. School of Mechanical Engineering, Hangzhou Dianzi University, Hangzhou 310018, China

作者Zhengran He; Kyeiwaa Asare-Yeboah; Meng Su; Jie Zhao

作者单位1. Electrical and Computer Engineering, Pennsylvania State University Behrend, Erie, PA 16563, USA; 2. Computer Science and Software Engineering, Pennsylvania State University Behrend, Erie, PA 16563, USA

作者Jie Li; Xiaomeng Zhang; Chong Yue; Wenbin Yin

作者单位1. Institute of Urban Underground Space and Energy, The Chinese University of Hong Kong, Shenzhen 518172, China; 2. Chongqing Academy of Metrology and Quality Inspection, Chongqing 401123, China; 3. College of Optoelectronic Engineering, Chongqing University, Chongqing 400030, China

作者Liang Xue; Jixiang Lu; Guangbin Cai; Bo Yang; Xinguo Wang

作者单位1. Department of Control Engineering, Rocket Force University of Engineering, Hongqing Town, No. 2 Tongxin Road, Xi’an 710025, China

作者Sungmin Bae; Dong-Jin Lee; Chuljin Hwang; Dae Yu Kim

作者单位1. Department of Electrical and Electronic Engineering, College of Engineering, Inha University, Incheon 22212, Republic of Korea; 2. Center for Sensor Systems, Inha University, Incheon 22212, Republic of Korea; 3. Department of Electrical and Computer Engineering, College of Engineering, Inha University, Incheon 22212, Republic of Korea; 4. Inha Research Institute for Aerospace Medicine, Inha University, Incheon 22212, Republic of Korea

作者Zhen Wang; Zekun Li; Hanqing Liu; Guanglu Hao; Bo Li; Kairui Cao

作者单位1. The 34th Research Institute of China Electronics Technology Group Corporation, Guilin 541004, China; 2. School of Information and Communication Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China; 3. National Key Laboratory of Laser Spatial Information, Harbin Institute of Technology, Harbin 150001, China

作者Hye Rin Do; Jun Ha Wee; Hwa Rim Lee; Young Chae Lee; Yunna Song; Sung Gyu Pyo

作者单位1. School of Integrative Engineering, Chung-Ang University, 84 Heukseok-ro, Dongjak-gu, Seoul 06974, Republic of Korea

作者Tao Wang; Zibang Xiao; Peicang Chen; Meng Nie; Zhen Yan; Shijie Deng; Jing Chen; Xiaolin Wang; Jingquan Liu

作者单位1. National Key Laboratory of Advanced Micro and Nano Manufacture Technology, Shanghai Jiao Tong University, Shanghai 200240, China; 2. Wuxi Zhongwei Microchips Co., Ltd., Wuxi 210093, China; 3. Key Laboratory of MEMS of the Ministry of Education, School of Integrated Circuits, Southeast University, Nanjing 210096, China; 4. School of Mechano-Electronic Engineering, Xidian University, Xi’an 710071, China

作者Jorge Davalos-Guzman; Jose L. Chavez-Hurtado; Lina M. Aguilar-Lobo

作者单位1. División de Ingenierías, Subdirección de Investigación y Extensión, Centro de Enseñanza Técnica Industrial, Plantel Tonalá, Tonalá 45402, Jalisco, Mexico; 2. Department of Electronics, Systems, and Informatics, Instituto Tecnológico y de Estudios Superiores de Occidente (ITESO), The Jesuit University of Guadalajara, Tlaquepaque 45604, Jalisco, Mexico; 3. Departamento de Computación e Industrial, Universidad Autónoma de Guadalajara, Av. Patria 1201, Zapopan 45129, Jalisco, Mexico